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SAK-TC277TP-64F200N Dc AURIX Microcontroller Chip Ic 32-Bit Tri-Core 200MHz 4MB 4M X 8 FLASH PG-LFBGA-292-6

Shenzhen Zhaocun Electronics Co., Ltd.
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    Buy cheap SAK-TC277TP-64F200N Dc AURIX Microcontroller Chip Ic 32-Bit Tri-Core 200MHz 4MB 4M X 8 FLASH PG-LFBGA-292-6 from wholesalers
     
    Buy cheap SAK-TC277TP-64F200N Dc AURIX Microcontroller Chip Ic 32-Bit Tri-Core 200MHz 4MB 4M X 8 FLASH PG-LFBGA-292-6 from wholesalers
    • Buy cheap SAK-TC277TP-64F200N Dc AURIX Microcontroller Chip Ic 32-Bit Tri-Core 200MHz 4MB 4M X 8 FLASH PG-LFBGA-292-6 from wholesalers

    SAK-TC277TP-64F200N Dc AURIX Microcontroller Chip Ic 32-Bit Tri-Core 200MHz 4MB 4M X 8 FLASH PG-LFBGA-292-6

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    Brand Name : Infineon Technologies
    Model Number : SAK-TC277TP-64F200N
    Certification : RoHS
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T
    Supply Ability : 1000 PCS
    Delivery Time : 2-3 DAYS
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    SAK-TC277TP-64F200N Dc AURIX Microcontroller Chip Ic 32-Bit Tri-Core 200MHz 4MB 4M X 8 FLASH PG-LFBGA-292-6

    SAK-TC277TP-64F200N TriCore™ AURIX™ Microcontroller IC 32-Bit Tri-Core 200MHz 4MB (4M x 8) FLASH PG-LFBGA-292-6


    Datasheet:SAK-TC277TP-64F200N

    CategoryMicrocontrollers
    MfrInfineon Technologies
    SeriesAURIX
    Product StatusActive
    Digi-Key ProgrammableNot Verified
    Core ProcessorTriCore
    Core Size32-Bit Tri-Core
    Speed200MHz
    ConnectivityASC, CANbus, Ethernet, FlexRay, HSSL,I²C, LINbus, MSC, PSI5, QSPI, SENT
    PeripheralsDMA, POR, WDT
    Number of I/O169
    Program Memory Size4MB (4M x 8)
    Program Memory TypeFLASH
    EEPROM Size64K x 8
    RAM Size472K x 8
    Voltage - Supply (Vcc/Vdd)1.17V ~ 5.5V
    Data ConvertersA/D 60x12b SAR, Sigma-Delta
    Oscillator TypeExternal
    Operating Temperature-40°C ~ 125°C(TA)
    Mounting TypeSurface Mount
    Package / Case292-LFBGA
    Supplier Device PackagePG-LFBGA-292-6
    Base Product NumberTC277TP64

    Summary of Features

    The TC27x product family has the following features:

    • High Performance Microcontroller with three CPU cores

    • Two 32-bit super-scalar TriCore CPUs (TC1.6P), each having the following features:

    – Superior real-time performance

    – Strong bit handling

    – Fully integrated DSP capabilities

    – Multiply-accumulate unit able to sustain 2 MAC operations per cycle

    – Fully pipelined Floating point unit (FPU)

    – up to 200 MHz operation at full temperature range

    – up to 120 Kbyte Data Scratch-Pad RAM (DSPR)

    – up to 32 Kbyte Instruction Scratch-Pad RAM (PSPR)

    – 16 Kbyte Instruction Cache (ICACHE)

    – 8 Kbyte Data Cache (DCACHE)

    • Power Efficient scalar TriCore CPU (TC1.6E), having the following features:

    – Binary code compatibility with TC1.6P

    – up to 200 MHz operation at full temperature range

    – up to 112 Kbyte Data Scratch-Pad RAM (DSPR)

    – up to 24 Kbyte Instruction Scratch-Pad RAM (PSPR)

    – 8 Kbyte Instruction Cache (ICACHE)

    – 0.125Kbyte Data Read Buffer (DRB)

    • Lockstepped shadow cores for one TC1.6P and for TC1.6E

    • Multiple on-chip memories

    – All embedded NVM and SRAM are ECC protected

    – up to 4 Mbyte Program Flash Memory (PFLASH)

    – up to 384 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation

    – 32 Kbyte Memory (LMU)

    – BootROM (BROM)

    • 64-Channel DMA Controller with safe data transfer

    • Sophisticated interrupt system (ECC protected)

    • High performance on-chip bus structure

    – 64-bit Cross Bar Interconnect (SRI) giving fast parallel access between bus masters, CPUs and memories

    – 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units

    – One bus bridge (SFI Bridge)

    • Optional Hardware Security Module (HSM) on some variants

    • Safety Management Unit (SMU) handling safety monitor alarms

    • Memory Test Unit with ECC, Memory Initialization and MBIST functions (MTU)

    • Hardware I/O Monitor (IOM) for checking of digital I/O

    • Versatile On-chip Peripheral Units

    – Four Asynchronous/Synchronous Serial Channels (ASCLIN) with hardware LIN support (V1.3, V2.0, V2.1 and J2602) up to 50 MBaud

    – Four Queued SPI Interface Channels (QSPI) with master and slave capability up to 50 Mbit/s

    – High Speed Serial Link (HSSL) for serial inter-processor communication up to 320 Mbit/s

    – Two serial Micro Second Bus interfaces (MSC) for serial port expansion to external power devices

    – One MultiCAN+ Module with 4 CAN nodes and 256 free assignable message objects for high efficiency data handling via FIFO buffering and gateway data transfer

    – 10 Single Edge Nibble Transmission (SENT) channels for connection to sensors

    – One FlexRayTM module with 2 channels (E-Ray) supporting V2.1

    – One Generic Timer Module (GTM) providing a powerful set of digital signal filtering and timer functionality to realize autonomous and complex Input/Output management

    – One Capture / Compare 6 module (Two kernels CCU60 and CCU61)

    – One General Purpose 12 Timer Unit (GPT120)

    – Three channel Peripheral Sensor Interface conforming to V1.3 (PSI5)

    – Peripheral Sensor Interface with Serial PHY (PSI5-S)

    – Optional Inter-Integrated Circuit Bus Interface (I2C) conforming to V2.1

    – Optional IEEE802.3 Ethernet MAC with RMII and MII interfaces (ETH)

    • Versatile Successive Approximation ADC (VADC)

    – Cluster of 8 independent ADC kernels

    – Input voltage range from 0 V to 5.5V (ADC supply)

    • Delta-Sigma ADC (DSADC) – Six channels

    • Digital programmable I/O ports

    • On-chip debug support for OCDS Level 1 (CPUs, DMA, On Chip Buses)

    • multi-core debugging, real time tracing, and calibration

    • four/five wire JTAG (IEEE 1149.1) or DAP (Device Access Port) interface

    • Power Management System and on-chip regulators

    • Clock Generation Unit with System PLL and Flexray PLL

    • Embedded Voltage Regulator


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